IC Substrate
Substrate boards that connect IC dies to the main PCB.
Last updated
IC Substrate samples
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Immersion gold + OSP IC substrate board
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4L 2 oz green immersion gold IC substrate board
About IC Substrate
An IC substrate, or package substrate, sits between a silicon die and the main PCB. Its very fine traces fan the die's connections out to a pitch the PCB can accept, and it gives the package mechanical support and a path for heat.
We supply IC substrate boards with immersion gold, OSP or a combination of both, including 4-layer substrates with 2 oz copper.
Typical applications
- BGA and chip-scale packages
- Memory packages
- Sensor and MEMS packages
- Power modules
- LED packages
Common questions
How is an IC substrate different from a regular PCB?
It is smaller and much finer, with tighter line widths and more precise vias, because it connects directly to a die through wire bonds or flip-chip bumps.
Which surface finish should I choose for an IC substrate?
Immersion gold gives a flat, durable surface for bonding and fine-pitch pads. OSP is a lower-cost option for areas that are only soldered, and some substrates use both.
Have a board to build?
Send us your Gerber files and requirements. Our team will review your specifications and get back to you with a quote.